Astro Bug

SANTA CLARA, Calif. - AstroBug -- ESPEC North America will exhibit at PCB West 2026 at the Santa Clara Convention Center, booth 518, bringing its semiconductor reliability test portfolio to the largest printed circuit board conference in Silicon Valley. The conference runs September 29 through October 2, with the exhibition floor open one day only on Wednesday, September 30.

As semiconductor manufacturing expands across North America, engineers need test methods that catch failure modes standard functional testing misses. Two are increasingly common on dense boards. Electrochemical migration surfaces in the field rather than on the bench, and solder joint fatigue under thermal cycling produces intermittent failures that are expensive to diagnose after shipment.

ESPEC will show two integrated pairings addressing both.

The AMI electrochemical migration evaluation system monitors for gradual resistance drift and sudden migration events, with detection under 100 microseconds. It supports up to 300 channels with independent module control and testing voltages from 100V standard to 2,500V, complying with IPC-TM-650 (2.6.3.3), AEC-Q200, and ISO/IEC 17025. AMI pairs with ESPEC HAST chambers, which combine high temperature, elevated humidity, and positive pressure to accelerate moisture-related failures. Running them together synchronizes electrical measurement with the environmental conditions producing it, in a single test.

More on Astro Bug

• Brian G. Miller Co., LLC Receives Tier 1 Ranking in the 2027 Edition of Best Law Firms®
• The Villari Firm, PLLC Named to the 2027 Edition of Best Law Firms
• Bacchus Wine & Spirits and Michelin Guide–Recommended Ethel's Fancy to Host Exclusive LOUIS XIII Limited Edition Diwali Decanter Celebration
• Planned PEThood's Free Vaccine Clinic Serves 650+ Pets in Record-Breaking Gwinnett County Event
• Arizona Pest Control Surpasses $200,000 in Contributions to Southern Arizona High School Sports and Education Programs

The AMR conductor resistance evaluation system provides continuous monitoring of solder joint and conductor resistance through thermal cycling, with accuracy of plus or minus 0.5% at 100 mOhm and scaling from 40 to 280 channels. Every unit ships with ISO/IEC 17025-compliant calibration. AMR pairs with the TSE-12 thermal shock chamber, correlating resistance data with temperature transitions as they happen rather than reporting pass or fail at the end of a run.

Both systems are engineered by ESPEC to work with ESPEC chambers. That means synchronized data, simpler setup, and one point of contact for calibration and service.

More on Astro Bug

• ZenaTech (NAS DAQ: ZENA) $1 Million in New Utility Contracts- Potential $2.5 Million Follow-On Opportunity Puts Its Drone Business in the Spotlight!
• New Patient Data Show REQORSA® Activating Cellular Repair Pathways as Roche Collaboration Advances Precision Lung Cancer Strategy for Genprex, Inc
• Genuine Hospitality, LLC Selected to Operate Holiday Inn Express & Suites Jacksonville – Town Center
• Shiokly Launches Online Marketplace to Help Singapore Home-Based Businesses Sell More, With First Product Listed Free
• Freight Broker 911 and Milton Collier Introduce "What's The 911?"—A New Podcast Built on Real Talk, Real Freight, and Real Opportunity

ESPEC North America is part of ESPEC Corp., the world's largest company dedicated exclusively to environmental test chambers, with ISO 9001:2015 manufacturing certification. The AMI and AMR line originates from ESPEC's Japanese engineering organization and is now expanding into North American labs.

The PCB West exhibition floor runs a single day and the Printed Circuit Engineering Association reports it often sells out. With more than 2,000 attendees, ESPEC recommends scheduling ahead. Engineers can reserve time with the team before September 30 or call 616-896-6100.

About ESPEC
ESPEC Corp. is the world's largest manufacturer of environmental test chambers. ESPEC North America offers a full range of environmental test chambers and related services across the continent.